芯片测试,测试座,IC SOCKET,IC测试座,高频测试座,IC老化座(IC Test and Burn-In Socket),LGA测试座,QFN测试座,QFP测试座,SOP测试座,TSOP测试座,BGA测试座,BGA适配器,PLCC测试座,SOT测试座.

蝶形激光器插座

AZIMUTH老化座

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更多规格及客制化产品请联系本公司获取 Specifications: • Insulator: PolyphenyleneSulfide (PPS) • Contact: Beryllium Copper (BeCu) Spring Tempered • Plating: 30μ inches gold over 30μ inches nickel •Temperature Range: -55°C to +155°C 　 Design Features: • Thru hole design. • Compact size for high board density. • Designed for leaded packages with .150 [3.81] min lead length. • Available on G-10 mounting boards or custom PCB. • Use 2 or more sockets for packages with leads on 2 or more sides. • Replacement components available.
高品质芯片测试插座，BGA/LGA/CGA/QFN/QFP/SOP/PGA/DIP

芯片测试插座

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菱美电子提供最全的BGA/LGA/CGA测试/老化插座产品,依托欧洲领先的BGA测试产品生产工艺,为客户提供优质的BGA/CSP/LGA测试插座产品,并可根据客户芯片的规格,提供定制化的服务.BGA测试插座分球形出脚(SMT)和针形出脚两种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.部分BGA插座货期更短至2-3周。并可根据客户的BGA器件出脚，定制合适的BGA插座(Available for any chip size and grid pattern)。     老化插座的工作温度一般为：-55°C~150 °C
AZIMUTH LCC老化座

AZIMUTH老化座

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Azimuth Electronics provides the automotive, commercial, medical, military, and telecommunications industries with an organization equipped and ready to supply state of the art concepts in socketry. Founded by a father and son team, the Johnsen's have been involved with the needs of the electronics industry for socketing the tube, transistor, micro-module, through the integrated circuit, leadless chip carrier, module tab, multi-chip module, array and chip scale packages. In the early eighties, our involvement with very high-speed integrated circuits resulted in designs for contactors and carrier systems on 0.020 in. and 0.50 mm lead centers. Today's socketing challenges include very large and very small packages with higher I.O. counts, closer pitches along with requirements for faster testing speeds and extended contact life span.
AZIMUTH QFP/CQFP/LQFP老化测试座

AZIMUTH老化座

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Azimuth Electronics provides the automotive, commercial, medical, military, and telecommunications industries with an organization equipped and ready to supply state of the art concepts in socketry. Founded by a father and son team, the Johnsen's have been involved with the needs of the electronics industry for socketing the tube, transistor, micro-module, through the integrated circuit, leadless chip carrier, module tab, multi-chip module, array and chip scale packages. In the early eighties, our involvement with very high-speed integrated circuits resulted in designs for contactors and carrier systems on 0.020 in. and 0.50 mm lead centers. Today's socketing challenges include very large and very small packages with higher I.O. counts, closer pitches along with requirements for faster testing speeds and extended contact life span.
PGA测试座/PGA老化座

芯片测试插座

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菱美电子提供最全的PGA封装之IC测试/老化测试插座,常用型号均备有大量现货.同时依托欧洲领先的BGA/QFN测试产品生产工艺,为客户提供优质的QFN/MLF/DFN测试插座产品,并可根据客户芯片的规格,提供定制化的服务.
QFN测试插座/老化插座

E-TEC测试/老化插座

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菱美电子提供最全的QFN/MLF/DFN等封装之IC测试/老化测试插座,脚距从0.4mm至1.0mm,常用型号均备有大量现货.同时依托欧洲领先的BGA/QFN测试产品生产工艺,为客户提供优质的QFN/MLF/DFN测试插座产品,并可根据客户芯片的规格,提供定制化的服务.
ENPLAS TSOP老化座

ENPLAS老化座

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菱美电子提供最全的SOP/SSOP/MSOP/TSOP等封装之IC测试座/老化测试插座,常用型号均备有大量现货.
E-TEC TwistLock类型测试插座/老化测试插座

E-TEC测试/老化插座

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BGA/LGA/CGA/QFN/QFP高频测试插座产品分球形出脚(SMT)和针形出脚及接触式三种<img src="http://mobf471b3.pic40.websiteonline.cn/upload/twistlockphone1.jpg" height="85" width="150"/>设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.部分BGA插座货期更短至2-3周。并可根据客户的BGA器件出脚，定制合适的BGA插座(Available for any chip size and grid pattern)。

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