高品质芯片测试插座,BGA/LGA/CGA/QFN/QFP/SOP/PGA/DIP

高品质芯片测试插座,BGA/LGA/CGA/QFN/QFP/SOP/PGA/DIP

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菱美电子提供最全的BGA/LGA/CGA测试/老化插座产品,依托欧洲领先的BGA测试产品生产工艺,为客户提供优质的BGA/CSP/LGA测试插座产品,并可根据客户芯片的规格,提供定制化的服务.BGA测试插座分球形出脚(SMT)和针形出脚两种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA
Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.部分BGA插座货期更短至2-3周。并可根据客户的BGA器件出脚,定制合适的BGA插座(Available
for any chip size and grid pattern
)。  
   

老化插座的工作温度一般为:-55°C~150 °C


BGA/LGA/CGA/QFN/QFP高频测试插座产品分球形出脚(SMT)和针形出脚及接触式三种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.部分BGA插座货期更短至2-3周。并可根据客户的BGA器件出脚,定制合适的BGA插座(Available for any chip size and grid pattern)。
ClamShell “Injection Molded” Type  IC Development Sockets - Over View
  • very easy open/close method,no screws, no tools required

  • SMT, thru hole or compression mount

  • Bandwidths up to 3GHz (SMT)

  • Bandwidths over 10GHz (compression mount)

  • Integrated aluminum heatsink available

  • Lid opening allows for failure analysis/probing

  • Lid opening allows for optical IC development

  • Low profile and mounts in IC's footprint (SMT mount)

  • Pitches down to 0.5mm (SMT and thru hole mounts) or 0.4mm (compression mount)

  • Any grid

  • Operating temperature :-55C to 125C (up to 250°C or 450°C on request)



Opened Clamshell Type

MECHANICAL DATA

Contact life:

10,000 cycles min.

Solderability :

as per IEC 60068-2-58

Individual contact force:

40 grams max.

MATERIAL

Insulator (RoHS Compliant):

High temp plastic or epoxy FR4

Terminal (RoHS compliant):

Brass

Contact (RoHS compliant):

BeCu

ELECTRICAL DATA

Contact resistance:

< 100 mΩ

Current rating:

500 mA max.

Insulation resistance:

at 500V DC  100 MΩ if 0.50 to 0.80mm pitch
                  500 MΩ 1.00mm pitch upwards

Breakdown voltage:

 at 60 Hz   500V min.

Capacitance:

< 1 pF

Inductance:

< 2 nH

Operating temperature:

-55°C to +125°C ; 260°C for 60 sec.