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Specifications:

• Insulator:
PolyphenyleneSulfide (PPS)

• Contact:
Beryllium Copper (BeCu) Spring Tempered

• Plating: 30μ
inches gold over 30μ inches nickel

•Temperature
Range: -55°C to +155°C

Design
Features:

• Thru hole
design.

• Compact size
for high board density.

• Designed for
leaded packages with .150 [3.81] min lead length.

• Available on
G-10 mounting boards or custom PCB.

• Use 2 or more
sockets for packages with leads on 2 or more sides.

• Replacement
components available.