更多规格及客制化产品请联系本公司获取
Specifications:
• Insulator:
PolyphenyleneSulfide (PPS)
• Contact:
Beryllium Copper (BeCu) Spring Tempered
• Plating: 30μ
inches gold over 30μ inches nickel
•Temperature
Range: -55°C to +155°C
Design
Features:
• Thru hole
design.
• Compact size
for high board density.
• Designed for
leaded packages with .150 [3.81] min lead length.
• Available on
G-10 mounting boards or custom PCB.
• Use 2 or more
sockets for packages with leads on 2 or more sides.
• Replacement
components available.